PROCESS FOR FABRICATING CIRCUIT ASSEMBLIES USING ELECTRODEPOSITABLE DIELECTRIC COATING COMPOSITIONS

Details for Australian Patent Application No. 2003248742 (hide)

Owner PPG INDUSTRIES OHIO, INC.

Inventors SANDALA, Michael G.; WANG, Alan E.; ZAWACKY, Steven R.; MCCOLLUM, Gregory J.; MORIARITY, Thomas C.; OLSON, Kevin C.

Pub. Number AU-A-2003248742

PCT Number PCT/US03/20357

PCT Pub. Number WO2004/004428

Priority 10/184,192 27.06.02 US

Filing date 27 June 2003

Wipo publication date 19 January 2004

International Classifications

H05K 001/05 Printed circuits - Insulated metal substrate

H05K 003/44 Apparatus or processes for manufacturing printed circuits - Manufacturing insulated metal core circuits

H01L 023/498 Details of semiconductor or other solid state devices

C09D 005/44 Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced - for electrophoretic applications

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 10/184,192 27.06.02 US

4 March 2004 Application Open to Public Inspection

  Published as AU-A-2003248742

7 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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