METHOD FOR CONSTRAINING THE SPREAD OF SOLDER DURING REFLOW FOR PREPLATED HIGH WETTABILITY LEAD FRAME FLIP CHIP ASSEMBLY

Details for Australian Patent Application No. 2003248608 (hide)

Owner ADVANPACK SOLUTIONS PTE LTD

Inventors CHEW, Alex; BRIAR, John; PEREZ, Roman; LAU, Kee, Kwang

Pub. Number AU-A-2003248608

PCT Number PCT/SG03/00165

PCT Pub. Number WO2004/040950

Priority 10/283,442 30.10.02 US

Filing date 10 July 2003

Wipo publication date 25 May 2004

International Classifications

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 001/18 Printed circuits - Printed circuits structurally associated with non-printed electric components

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 10/283,442 30.10.02 US

24 June 2004 Application Open to Public Inspection

  Published as AU-A-2003248608

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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