PACKAGE STRUCTURE AND SENSOR MODULE USING THE SAME

Details for Australian Patent Application No. 2003248491 (hide)

Owner SMATTECH, INC.

Inventors LEE, Hyeung-Gyu; LEE, Youn-Seob; SUNWOO, Kyun; JEON, In-Soo

Pub. Number AU-A-2003248491

PCT Number PCT/KR03/01536

PCT Pub. Number WO2004/097940

Priority 10-2003-0026772 28.04.03 KR

Filing date 30 July 2003

Wipo publication date 23 November 2004

International Classifications

H01L 027/146 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - Imager structures

H01L 023/00 Details of semiconductor or other solid state devices

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 10-2003-0026772 28.04.03 KR

23 December 2004 Application Open to Public Inspection

  Published as AU-A-2003248491

12 January 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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