METHOD FOR ACCELERATED BONDLINE CURING

Details for Australian Patent Application No. 2003247738 (hide)

Owner THERMION SYSTEMS INTERNATIONAL

Inventors SMITH, Faye, C.; GARDNER, Alan, D.; MILLER, Andrew, J.

Pub. Number AU-A-2003247738

PCT Number PCT/US03/20303

PCT Pub. Number WO2004/003096

Priority 60/392,416 28.06.02 US

Filing date 25 June 2003

Wipo publication date 19 January 2004

International Classifications

C09J 005/06 Adhesive processes in general - involving heating of the applied adhesive

B29C 065/34 Joining of preformed parts - using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"

H05B 003/34 Ohmic-resistance heating - flexible, e.g. heating nets or webs

Event Publications

2 October 2003 Complete Application Filed

  Priority application(s): 60/392,416 28.06.02 US

4 March 2004 Application Open to Public Inspection

  Published as AU-A-2003247738

7 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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