IC module, method of manufacturing and IC card

Details for Australian Patent Application No. 2003246072 (hide)

International Classifications

Event Publications

25 September 2003 Complete Application Filed

9 October 2003 Application Open to Public Inspection

Published as AU-B-2003246072

8 September 2005 Application Accepted

Published as AU-B-2003246072

12 January 2006 Standard Patent Sealed

11 February 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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