RESIN COMPOSITION

Details for Australian Patent Application No. 2003244465 (hide)

Owner SEKISUI CHEMICAL CO., LTD.

Inventors FUJIWARA, Akihiko; SHIBAYAMA, Koichi; DEGUCHI, Hidenobu

Pub. Number AU-A-2003244465

PCT Number PCT/JP03/01089

PCT Pub. Number WO2003/066740

Priority 2002-029783 06.02.02 JP; 2002-139090 14.05.02 JP; 2002-158210 30.05.02 JP; 2002-287005 30.09.02 JP

Filing date 4 February 2003

Wipo publication date 2 September 2003

International Classifications

C08L 101/00 Compositions of unspecified macromolecular compounds

C08K 003/00 Use of inorganic ingredients

B32B 015/08 Layered products essentially comprising metal - of synthetic resin

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 001/03 Printed circuits - Use of materials for the substrate

Event Publications

18 September 2003 Complete Application Filed

  Priority application(s): 2002-029783 06.02.02 JP; 2002-139090 14.05.02 JP; 2002-158210 30.05.02 JP; 2002-287005 30.09.02 JP

25 September 2003 Application Open to Public Inspection

  Published as AU-A-2003244465

3 August 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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