COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE

Details for Australian Patent Application No. 2003241801 (hide)

Owner TAIYO YUDEN CO., LTD.

Inventors MIYAZAKI, Masashi; TAKAYAMA, Mitsuhiro; SAWATARI, Tatsuro

Pub. Number AU-A-2003241801

PCT Number PCT/JP03/06597

PCT Pub. Number WO2003/103355

Priority 2002-156796 30.05.02 JP

Filing date 27 May 2003

Wipo publication date 19 December 2003

International Classifications

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 003/28 Apparatus or processes for manufacturing printed circuits - Applying non-metallic protective coatings

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H01L 025/04 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices not having separate containers

H05K 001/18 Printed circuits - Printed circuits structurally associated with non-printed electric components

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 2002-156796 30.05.02 JP

12 February 2004 Application Open to Public Inspection

  Published as AU-A-2003241801

3 March 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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