METHOD FOR CONTACT BONDING ELECTRONIC COMPONENTS ON AN INSULATING SUBSTRATE AND COMPONENT MODULE PRODUCED ACCORDING TO SAID METHOD

Details for Australian Patent Application No. 2003240426 (hide)

Owner SIEMENS DEMATIC AG

Inventors HEERMAN, Marcel

Pub. Number AU-A-2003240426

PCT Number PCT/DE03/01795

PCT Pub. Number WO2003/105222

Priority 102 25 431.1 07.06.02 DE

Filing date 6 June 2003

Wipo publication date 22 December 2003

International Classifications

H01L 023/13 Details of semiconductor or other solid state devices

H01L 023/538 Details of semiconductor or other solid state devices

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 102 25 431.1 07.06.02 DE

19 February 2004 Application Open to Public Inspection

  Published as AU-A-2003240426

24 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003240427-NOVEL BENZIMIDAZOL-2-ONE DERIVATIVES AND THEIR USE

2003240425-VERTICAL ROTOR COMPRISING GUIDABLE BLADES