THERMOCONDUCTIVE CURABLE LIQUID POLYMER COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED WITH THE USE OF THIS COMPOSITION

Details for Australian Patent Application No. 2003240017 (hide)

Owner DOW CORNING TORAY SILICONE CO.,LTD.

Inventors YAMAKAWA, Kimio; NAKAYOSHI, Kazumi; ISHIKAWA, Hiroki; MINE, Katsutoshi

Pub. Number AU-A-2003240017

PCT Number PCT/JP03/06798

PCT Pub. Number WO2003/102071

Priority 2002-158434 31.05.02 JP

Filing date 29 May 2003

Wipo publication date 19 December 2003

International Classifications

C08K 007/00 Use of ingredients characterised by shape

H01L 023/373 Details of semiconductor or other solid state devices

C08L 083/04 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 2002-158434 31.05.02 JP

12 February 2004 Application Open to Public Inspection

  Published as AU-A-2003240017

17 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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