PARTIALLY PATTERNED LEAD FRAMES AND METHODS OF MAKING AND USING THE SAME IN SEMICONDUCTOR PACKAGING

Details for Australian Patent Application No. 2003239183 (hide)

Owner ADVANCED INTERCONNECT TECHNOLOGIES LIMITED

Inventors SAN ANTONIO, Romarico, S.; ISLAM, Shafidul

Pub. Number AU-A-2003239183

PCT Number PCT/US03/13046

PCT Pub. Number WO2003/103038

Priority 10/134,882 29.04.02 US; 10/342,732 15.01.03 US

Filing date 28 April 2003

Wipo publication date 19 December 2003

International Classifications

H01L 021/44 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/495 Details of semiconductor or other solid state devices

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/50 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 10/134,882 29.04.02 US; 10/342,732 15.01.03 US

12 February 2004 Application Open to Public Inspection

  Published as AU-A-2003239183

27 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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