ABRASIVE PARTICLES TO CLEAN SEMICONDUCTOR WAFERS DURING CHEMICAL MECHANICAL PLANARIZATION

Details for Australian Patent Application No. 2003238888 (hide)

Owner ARIZONA BOARD OF REGENTS BEAUDOIN, Stephen

Inventors BEAUDOIN, Stephen

Pub. Number AU-A-2003238888

PCT Number PCT/US03/17628

PCT Pub. Number WO2003/104344

Priority 60/386,127 05.06.02 US

Filing date 5 June 2003

Wipo publication date 22 December 2003

International Classifications

H01L 021/302 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C09K 003/14 Materials not provided for elsewhere - Anti-slip materials

C09G 001/02 Polishing compositions

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 60/386,127 05.06.02 US

19 February 2004 Application Open to Public Inspection

  Published as AU-A-2003238888

24 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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