METHOD FOR SEALING POROUS MATERIALS DURING CHIP PRODUCTION AND COMPOUNDS THEREFOR

Details for Australian Patent Application No. 2003238515 (hide)

Owner INFINEON TECHNOLOGIES AG

Inventors TEMPEL, Georg; HEILIGER, Ludger; SCHMIDT, Michael

Pub. Number AU-A-2003238515

PCT Number PCT/EP03/06527

PCT Pub. Number WO2004/000960

Priority 102 27 663.3 20.06.02 DE

Filing date 20 June 2003

Wipo publication date 6 January 2004

International Classifications

C09D 201/10 Coating compositions based on unspecified macromolecular compounds

C08F 230/08 Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium, or a metal

C09D 143/04 Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 102 27 663.3 20.06.02 DE

4 March 2004 Application Open to Public Inspection

  Published as AU-A-2003238515

10 March 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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