LARGE-DIAMETER SIC WAFER AND MANUFACTURING METHOD THEREOF

Details for Australian Patent Application No. 2003238163 (hide)

Owner MITSUI ENGINEERING AND SHIPBUILDING CO.,LTD.

Inventors NISHINO, Shigehiro; MURATA, Kazutoshi

Pub. Number AU-A-2003238163

PCT Number PCT/JP03/08312

PCT Pub. Number WO2004/008506

Priority 2002-202953 11.07.02 JP

Filing date 30 June 2003

Wipo publication date 2 February 2004

International Classifications

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

H01L 021/205 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C30B 029/36 Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape

C03B 029/06 Reheating glass products for softening or fusing their surfaces

Event Publications

11 September 2003 Complete Application Filed

  Priority application(s): 2002-202953 11.07.02 JP

18 March 2004 Application Open to Public Inspection

  Published as AU-A-2003238163

7 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003238164-ELECTROCHEMICAL OXYGEN SEPARATOR CELL

2003238162-Decellularized tissue