AN INTEGRATED CIRCUIT PACKAGE EMPLOYING A FLEXIBLE SUBSTRATE

Details for Australian Patent Application No. 2003237768 (hide)

Owner INFINEON TECHNOLOGIES AG

Inventors FERNANDEZ, Elstan, Anthony

Pub. Number AU-A-2003237768

PCT Number PCT/SG03/00125

PCT Pub. Number WO2004/107441

Filing date 28 May 2003

Wipo publication date 21 January 2005

International Classifications

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 023/36 Details of semiconductor or other solid state devices

H05K 007/20 Constructional details common to different types of electric apparatus - Modifications to facilitate cooling, ventilating, or heating

Event Publications

11 September 2003 Complete Application Filed

10 February 2005 Application Open to Public Inspection

  Published as AU-A-2003237768

16 February 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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