POLISHING PAD AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD USING THE POLISHING PAD

Details for Australian Patent Application No. 2003236328 (hide)

Owner TOHO ENGINEERING KABUSHIKI KAISHA

Inventors SUZUKI, Tatsutoshi

Pub. Number AU-A-2003236328

PCT Number PCT/JP03/04189

PCT Pub. Number WO2003/083918

Priority 2002/101945 03.04.02 JP; 2002/378965 27.12.02 JP

Filing date 1 April 2003

Wipo publication date 13 October 2003

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

4 September 2003 Complete Application Filed

  Priority application(s): 2002/101945 03.04.02 JP; 2002/378965 27.12.02 JP

20 November 2003 Application Open to Public Inspection

  Published as AU-A-2003236328

27 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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