HEATER TIP FOR THERMOCOMPESSION BONDING

Details for Australian Patent Application No. 2003236088 (hide)

Owner KOBO PDA CO., LTD.

Inventors ISHII, Tatsuya

Pub. Number AU-A-2003236088

PCT Number PCT/JP03/04597

PCT Pub. Number WO2003/097288

Priority 2002-139566 15.05.02 JP

Filing date 11 April 2003

Wipo publication date 2 December 2003

International Classifications

B23K 003/047 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods

Event Publications

4 September 2003 Complete Application Filed

  Priority application(s): 2002-139566 15.05.02 JP

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003236088

3 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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