POLISHING FLUID AND POLISHING METHOD

Details for Australian Patent Application No. 2003235964 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors KURATA, Yasushi; MASUDA, Katsuyuki; ONO, Hiroshi; KAMIGATA, Yasuo; ENOMOTO, Kazuhiro

Pub. Number AU-A-2003235964

PCT Number PCT/JP03/05465

PCT Pub. Number WO2003/094216

Priority 2002-128644 30.04.02 JP; 2002-160159 31.05.02 JP

Filing date 28 April 2003

Wipo publication date 17 November 2003

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24B 037/00 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped

B24B 057/02 Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

Event Publications

4 September 2003 Complete Application Filed

  Priority application(s): 2002-128644 30.04.02 JP; 2002-160159 31.05.02 JP

8 January 2004 Application Open to Public Inspection

  Published as AU-A-2003235964

20 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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