PACKAGING METHOD AND PACKAGING SYSTEM

Details for Australian Patent Application No. 2003235375 (hide)

Owner TORAY ENGINEERING CO., LTD.

Inventors YAMAUCHI, Akira

Pub. Number AU-A-2003235375

PCT Number PCT/JP03/05119

PCT Pub. Number WO2003/092052

Priority 2002-125814 26.04.02 JP

Filing date 22 April 2003

Wipo publication date 10 November 2003

International Classifications

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

4 September 2003 Complete Application Filed

  Priority application(s): 2002-125814 26.04.02 JP

18 December 2003 Application Open to Public Inspection

  Published as AU-A-2003235375

20 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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