WAFER DEMOUNTING METHOD, WAFER DEMOUNTING DEVICE, AND WAFER DEMOUNTING AND TRANSFERRING MACHINE

Details for Australian Patent Application No. 2003235243 (hide)

Owner MIMASU SEMICONDUCTOR INDUSTRY CO.,LTD.

Inventors TSUCHIYA, Masato; MASHIMO, Ikuo; SAITO, Koichi

Pub. Number AU-A-2003235243

PCT Number PCT/JP03/05947

PCT Pub. Number WO2004/102654

Filing date 13 May 2003

Wipo publication date 3 December 2004

International Classifications

H01L 021/68 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B65G 049/06 Conveying systems characterised by their application for specified purposes not otherwise provided for

B65G 049/07 Conveying systems characterised by their application for specified purposes not otherwise provided for - for semiconductor wafers

B65H 003/08 Separating articles from piles - using pneumatic force

B65H 003/48 Separating articles from piles - Air blast acting on edges of, or under, articles

B65G 059/04 De-stacking of articles

Event Publications

4 September 2003 Complete Application Filed

13 January 2005 Application Open to Public Inspection

  Published as AU-A-2003235243

2 February 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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