CONDUCTIVE PASTE, MULTILAYER BOARD INCLUDING THE CONDUCTIVE PASTE AND PROCESS FOR PRODUCING THE SAME

Details for Australian Patent Application No. 2003234852 (hide)

Owner TATSUTA ELECTRIC WIRE AND CABLE CO., LTD.

Inventors UMEDA, Hiroaki; MURAKAMI, Hisatoshi; IWAI, Kiyoshi

Pub. Number AU-A-2003234852

PCT Number PCT/JP03/06621

PCT Pub. Number WO2003/105160

Priority 2002-160692 31.05.02 JP

Filing date 27 May 2003

Wipo publication date 22 December 2003

International Classifications

H01B 001/20 Conductors or conductive bodies characterised by the conductive materials - Conductive material dispersed in non-conductive organic material

H05K 001/09 Printed circuits - Use of materials for the metallic pattern

Event Publications

28 August 2003 Complete Application Filed

  Priority application(s): 2002-160692 31.05.02 JP

19 February 2004 Application Open to Public Inspection

  Published as AU-A-2003234852

17 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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