NANOPARTICLE FILLED UNDERFILL

Details for Australian Patent Application No. 2003234394 (hide)

Owner 3M INNOVATIVE PROPERTIES COMPANY

Inventors CHARLES, Scott B.,; GROSS, Kathleen M.,; HACKETT, Steven C.,; KROPP, Michael A.,; SCHULTZ, William J.,; THOMPSON, Wendy L.,

Pub. Number AU-A-2003234394

PCT Number PCT/US03/14838

PCT Pub. Number WO2003/101164

Priority 60/383,379 23.05.02 US

Filing date 13 May 2003

Wipo publication date 12 December 2003

International Classifications

H05K 001/18 Printed circuits - Printed circuits structurally associated with non-printed electric components

H05K 003/30 Apparatus or processes for manufacturing printed circuits - Assembling printed circuits with electric components, e.g. with resistor

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

28 August 2003 Complete Application Filed

  Priority application(s): 60/383,379 23.05.02 US

5 February 2004 Application Open to Public Inspection

  Published as AU-A-2003234394

10 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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