COPPER-NICKEL-SILICON TWO PHASE QUENCH SUBSTRATE

Details for Australian Patent Application No. 2003233567 (hide)

Owner HONEYWELL INTERNATIONAL INC.

Inventors MYOJIN, Shinya; BYE, Richard, L.; SCHUSTER, Gary, B., A.; WALLS, Dale, R.; COX, Joseph, G.; MILLURE, David, W.; LIN, Jeng, S.; DECRISTOFARO, Nicholas, J.

Pub. Number AU-A-2003233567

PCT Number PCT/US03/15665

PCT Pub. Number WO2003/097886

Priority 10/150,382 17.05.02 US

Filing date 15 May 2003

Wipo publication date 2 December 2003

International Classifications

C22C 009/06 Alloys based on copper - with nickel or cobalt as the next major constituent

C22F 001/08 Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working - of copper or alloys based thereon

B22D 011/06 Particular casting processes - into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars

Event Publications

28 August 2003 Complete Application Filed

  Priority application(s): 10/150,382 17.05.02 US

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003233567

3 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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