High density 3-D integrated circuit package

Details for Australian Patent Application No. 2003232883 (hide)

Owner Honeywell International Inc.

Inventors Rau, James R; Sullivan, Gerard J; Hughes, A James; Adkins, Larry R

Agent Davies Collison Cave

Pub. Number AU-B-2003232883

PCT Number PCT/US03/01910

PCT Pub. Number WO2003/069969

Priority 10/054,374 22.01.02 US

Filing date 22 January 2003

Wipo publication date 4 September 2003

Acceptance publication date 13 July 2006

International Classifications

H05K 7/02 (2006.01) Constructional details common to different types of electric apparatus - Arrangements of circuit components or wiring on supporting structure

H01L 23/02 (2006.01) Details of semiconductor or other solid state devices - Containers

H01L 23/06 (2006.01) Details of semiconductor or other solid state devices

H01L 25/04 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices not having separate containers

H01L 25/065 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 25/07 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 25/10 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices having separate containers

H01L 25/18 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of types provided for in two or more different subgroups of the same main group of groups

H05K 1/14 (2006.01) Printed circuits - Structural association of two or more printed circuits

Event Publications

28 August 2003 Complete Application Filed

  Priority application(s): 10/054,374 22.01.02 US

2 October 2003 Application Open to Public Inspection

  Published as AU-B-2003232883

13 July 2006 Application Accepted

  Published as AU-B-2003232883

9 November 2006 Standard Patent Sealed

14 August 2008 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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