METHOD OF MAKING A LOW PROFILE PACKAGED SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2003231137 (hide)

Owner SEMICONDUCTOR COMPONENTS INDUSTRIES L.L.C.

Inventors ANDERSON, Harold G.; KNAPP, James Howard; YODER, Jay A.

Pub. Number AU-A-2003231137

PCT Number PCT/US03/13027

PCT Pub. Number WO2004/100255

Filing date 29 April 2003

Wipo publication date 26 November 2004

International Classifications

H01L 021/68 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/607 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

14 August 2003 Complete Application Filed

6 January 2005 Application Open to Public Inspection

  Published as AU-A-2003231137

12 January 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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