SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME

Details for Australian Patent Application No. 2003230678 (hide)

Owner DOW CORNING CORPORATION

Inventors DENT, Stanton; LARSON, Lyndon; NELSON, Robert; SOLIZ, Debra

Pub. Number AU-A-2003230678

PCT Number PCT/US03/08345

PCT Pub. Number WO2003/098682

Priority 10/068,755 16.05.02 US

Filing date 19 March 2003

Wipo publication date 2 December 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/485 Details of semiconductor or other solid state devices

H01L 021/312 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

14 August 2003 Complete Application Filed

  Priority application(s): 10/068,755 16.05.02 US

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003230678

3 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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