OPTIMIZATION OF DIE PLACEMENT ON WAFERS

Details for Australian Patent Application No. 2003230365 (hide)

International Classifications

Event Publications

14 August 2003 Complete Application Filed

Priority application(s): 60/379,194 10.05.02 US; Not Given 22.04.03 US; Not Given 03.05.03 US

15 January 2004 Application Open to Public Inspection

Published as AU-A-2003230365

27 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

10 December 2009 Corrigenda

Applications OPI - Name Index Under the name PDF Solutions, Inc., Application No. 2003230365, under INID (43) correct the publication date to read Corrigenda 24.11.2003

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