ELECTROCHEMICALLY FABRICATED HERMETICALLY SEALED MICROSTRUCTURES AND METHODS OF AND APPARATUS FOR PRODUCING SUCH STRUCTURES

Details for Australian Patent Application No. 2003228973 (hide)

International Classifications

Event Publications

14 August 2003 Complete Application Filed

Priority application(s): 60/379,182 07.05.02 US; 60/430,809 02.12.02 US

15 January 2004 Application Open to Public Inspection

Published as AU-A-2003228973

27 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

26 November 2009 Corrigenda

Applications OPI - Name Index Under the name Memgen Corporation , Application No. 2003228973 , under INID (43) correct the publication date to read 24.11.2003

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