APPARATUS, SYSTEM AND METHOD TO REDUCE WAFER WARPAGE

Details for Australian Patent Application No. 2003228739 (hide)

Owner INTEL CORPORATION

Inventors FUENTES, Anastacio, Jr.; ATIENZA, Reynaldo, Jr.; CLAVIO, Chesalon

Pub. Number AU-A-2003228739

PCT Number PCT/US03/13195

PCT Pub. Number WO2003/098675

Priority 10/145,171 13.05.02 US

Filing date 28 April 2003

Wipo publication date 2 December 2003

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24B 007/22 Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces

H01L 021/302 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/306 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

14 August 2003 Complete Application Filed

  Priority application(s): 10/145,171 13.05.02 US

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003228739

27 January 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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