ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE

Details for Australian Patent Application No. 2003225950 (hide)

Owner ASAT LIMITED COMBS, Edward, G. McCLELLAN, Neil, R. FAN, Chun Ho

Inventors McCLELLAN, Neil, R.; FAN, Chun Ho; COMBS, Edward, G.

Pub. Number AU-A-2003225950

PCT Number PCT/US03/08928

PCT Pub. Number WO2003/083956

Priority 10/104,263 22.03.02 US

Filing date 21 March 2003

Wipo publication date 13 October 2003

International Classifications

H01L 023/10 Details of semiconductor or other solid state devices

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

H01L 031/11 Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation

Event Publications

7 August 2003 Complete Application Filed

  Priority application(s): 10/104,263 22.03.02 US

20 November 2003 Application Open to Public Inspection

  Published as AU-A-2003225950

23 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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