SOLDER COMPOSITIONS FOR ATTACHING A DIE TO A SUBSTRATE

Details for Australian Patent Application No. 2003225119 (hide)

Owner MOTOROLA, INC.

Inventors STROUSE, Floyd; CARROLLSHEARER, Lori, D.; BESSER, Brant

Pub. Number AU-A-2003225119

PCT Number PCT/US03/12516

PCT Pub. Number WO2003/097294

Priority 10/145,503 14.05.02 US

Filing date 23 April 2003

Wipo publication date 2 December 2003

International Classifications

B23K 035/24 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting - Selection of soldering or welding materials proper

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

7 August 2003 Complete Application Filed

  Priority application(s): 10/145,503 14.05.02 US

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003225119

3 February 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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