METHOD AND APPARATUS FOR INTEGRATED CHEMICAL MECHANICAL POLISHING OF COPPER AND BARRIER LAYERS

Details for Australian Patent Application No. 2003224233 (hide)

Owner NUTOOL, INC.

Inventors TALIEH, Homayoun; BROWNE, Robin, F.; BASON, Bulent; YOUNG, Douglas; WANG, Yuchun; TRUONG, Tuan

Pub. Number AU-A-2003224233

PCT Number PCT/GB03/01066

PCT Pub. Number WO2003/079428

Priority 60/365,001 13.03.02 US; 10/199,471 19.07.02 US; 60/417,544 10.10.02 US; 10/346,425 17.01.03 US

Filing date 13 March 2003

Wipo publication date 29 September 2003

International Classifications

H01L 021/321 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

Event Publications

7 August 2003 Complete Application Filed

  Priority application(s): 60/365,001 13.03.02 US; 10/199,471 19.07.02 US; 60/417,544 10.10.02 US; 10/346,425 17.01.03 US

6 November 2003 Application Open to Public Inspection

  Published as AU-A-2003224233

2 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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