BONDING WIRE AND INTEGRATED CIRCUIT DEVICE USING THE SAME

Details for Australian Patent Application No. 2003221209 (hide)

Owner SUMITOMO ELECTRIC WINTEC, INCORPORATED

Inventors NONAKA, Tsuyoshi; KAIMORI, Shingo; IOKA, Masanori; FUKAGAYA, Masato

Pub. Number AU-A-2003221209

PCT Number PCT/JP03/03492

PCT Pub. Number WO2003/081661

Priority 2002-85891 26.03.02 JP

Filing date 24 March 2003

Wipo publication date 8 October 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C25D 007/12 Electroplating characterised by the article coated - Semiconductors

Event Publications

7 August 2003 Complete Application Filed

  Priority application(s): 2002-85891 26.03.02 JP

13 November 2003 Application Open to Public Inspection

  Published as AU-A-2003221209

16 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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