METHOD FOR MANUFACTURING ELECTRONIC COMPONENT-MOUNTED BOARD

Details for Australian Patent Application No. 2003221149 (hide)

Owner FUJITSU LIMITED

Inventors ABE, Tomoyuki; YAMAGISHI, Yasuo

Pub. Number AU-A-2003221149

PCT Number PCT/JP03/03661

PCT Pub. Number WO2004/086493

Filing date 25 March 2003

Wipo publication date 18 October 2004

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

7 August 2003 Complete Application Filed

18 November 2004 Application Open to Public Inspection

  Published as AU-A-2003221149

15 December 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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