INTERCONNECTION STRUCTURE AND METHODS

Details for Australian Patent Application No. 2003220653 (hide)

Owner HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventors FRICKE, Peter; KOLL, Andrew; VAN BROCKLIN, Andrew, L.; ANDERSON, Daryl

Pub. Number AU-A-2003220653

PCT Number PCT/US03/10225

PCT Pub. Number WO2003/085734

Priority 10/115,753 02.04.02 US

Filing date 2 April 2003

Wipo publication date 20 October 2003

International Classifications

H01L 023/522 Details of semiconductor or other solid state devices

H01L 027/10 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - including a plurality of individual components in a repetitive configuration

H01L 027/06 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - including a plurality of individual components in a non-repetitive configuration

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 10/115,753 02.04.02 US

27 November 2003 Application Open to Public Inspection

  Published as AU-A-2003220653

16 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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