MODULAR CONNECTOR WITH GROUNDING INTERCONNECT

Details for Australian Patent Application No. 2003220324 (hide)

Owner TYCO ELECTRONICS CORPORATION

Inventors HELSTER, David, Wayne; HENRY, Randall, Robert; FEDDER, James, Lee; SIPE, Lynn, Robert; FOWLER, David, Keay; TAYLOR, Attalee, Snarr; ROTHERMEL, Brent, Ryan; PHILLIPS, Michael, John; SHARF, Alexander, Michael

Pub. Number AU-A-2003220324

PCT Number PCT/US03/08057

PCT Pub. Number WO2003/081726

Priority 10/100,822 19.03.02 US

Filing date 14 March 2003

Wipo publication date 8 October 2003

International Classifications

H01R 012/20 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks

H01R 013/658 Details of coupling devices of the kinds covered by groups or - High frequency shielding arrangements

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 10/100,822 19.03.02 US

13 November 2003 Application Open to Public Inspection

  Published as AU-A-2003220324

9 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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