INTEGRATED CIRCUIT PACKAGE AND METHOD FOR PRODUCING IT

Details for Australian Patent Application No. 2003219633 (hide)

Owner INFINEON TECHNOLOGIES AG

Inventors CHAI, Fui Jin

Pub. Number AU-A-2003219633

PCT Number PCT/SG03/00042

PCT Pub. Number WO2004/077559

Filing date 27 February 2003

Wipo publication date 17 September 2004

International Classifications

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 021/98 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

31 July 2003 Complete Application Filed

21 October 2004 Application Open to Public Inspection

  Published as AU-A-2003219633

10 November 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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