SEMICONDUCTOR DEVICE HAVING A WIRE BOND PAD AND METHOD THEREFOR

Details for Australian Patent Application No. 2003218146 (hide)

Owner MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE

Inventors DOWNEY, Susan, H.; MILLER, James, W.; HALL, Geoffrey, B.

Pub. Number AU-A-2003218146

PCT Number PCT/US03/07783

PCT Pub. Number WO2003/079434

Priority 10/097,059 13.03.02 US

Filing date 12 March 2003

Wipo publication date 29 September 2003

International Classifications

H01L 023/00 Details of semiconductor or other solid state devices

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 10/097,059 13.03.02 US

6 November 2003 Application Open to Public Inspection

  Published as AU-A-2003218146

2 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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