WAFER-LEVEL COATED COPPER STUD BUMPS

Details for Australian Patent Application No. 2003218085 (hide)

Owner FAIRCHILD SEMICONDUCTOR CORPORATION

Inventors CRUZ, Erwin, Victor, R.; JOSHI, Rajeev; TANGPUZ, Consuelo

Pub. Number AU-A-2003218085

PCT Number PCT/US03/07421

PCT Pub. Number WO2003/079407

Priority 60/363,789 12.03.02 US

Filing date 10 March 2003

Wipo publication date 29 September 2003

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 60/363,789 12.03.02 US

6 November 2003 Application Open to Public Inspection

  Published as AU-A-2003218085

2 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003218086-OPTICAL WAVELENGTH CROSS CONNECT ARCHITECTURES USING WAVELENGTH ROUTING ELEMENTS AND METHODS FOR PERFORMING IN-SERVICE UPGRADES

2003218084-Systems and methods for implementing shader-driven compilation of rendering assets