ELECTRONIC ASSEMBLY HAVING COMPOSITE ELECTRONIC CONTACTS FOR ATTACHING A PACKAGE SUBSTRATE TO A PRINTED CIRCUIT BOARD

Details for Australian Patent Application No. 2003217194 (hide)

Owner INTEL CORPORATION

Inventors MARTIN, Edward, N.; BIGGS, Larry

Pub. Number AU-A-2003217194

PCT Number PCT/US03/00885

PCT Pub. Number WO2003/067946

Priority 10/068,494 04.02.02 US

Filing date 10 January 2003

Wipo publication date 2 September 2003

International Classifications

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 10/068,494 04.02.02 US

25 September 2003 Application Open to Public Inspection

  Published as AU-A-2003217194

28 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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