DEVICE FOR CUTTING A SUBSTRATE LAYER, AND CORRESPONDING METHOD

Details for Australian Patent Application No. 2003216776 (hide)

Owner S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES

Inventors RAYSSAC, Olivier; LETERTRE, Fabrice

Pub. Number AU-A-2003216776

PCT Number PCT/FR03/00002

PCT Pub. Number WO2003/059591

Priority 02/00028 03.01.02 FR

Filing date 2 January 2003

Wipo publication date 30 July 2003

International Classifications

B28D 005/00 Fine working of gems, jewels, crystals, e.g. of semiconductor material

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 02/00028 03.01.02 FR

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2003216776

23 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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