A PLASTICS LEADFRAME AND AN INTEGRATED CIRCUIT PACKAGE FABRICATED USING THE LEADFRAME

Details for Australian Patent Application No. 2003216033 (hide)

International Classifications

Event Publications

31 July 2003 Complete Application Filed

21 October 2004 Application Open to Public Inspection

Published as AU-A-2003216033

10 November 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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