PACKAGING INTEGRATED CIRCUITS

Details for Australian Patent Application No. 2003214769 (hide)

Owner INFINEON TECHNOLOGIES AG

Inventors CHUA, Ham Chu; TAN, Seng Gee; BAKAR, Roslie Saini bin; TAN, Sze Chee

Pub. Number AU-A-2003214769

PCT Number PCT/SG03/00018

PCT Pub. Number WO2004/068562

Filing date 28 January 2003

Wipo publication date 23 August 2004

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

31 July 2003 Complete Application Filed

23 September 2004 Application Open to Public Inspection

  Published as AU-A-2003214769

13 October 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003214770-REMOTE APPLICATION PUBLICATION AND COMMUNICATION SYSTEM

2003214768-MICROFLUIDIC DEVICES WITH NEW INNER SURFACES