Board-level EMI shield with enhanced thermal dissipation

Details for Australian Patent Application No. 2003213838 (hide)

International Classifications

Event Publications

31 July 2003 Complete Application Filed

Priority application(s): 10/120,251 10.04.02 US

4 December 2003 Application Open to Public Inspection

Published as AU-B-2003213838

3 November 2005 Application Accepted

Published as AU-B-2003213838

2 March 2006 Standard Patent Sealed

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