PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF

Details for Australian Patent Application No. 2003213432 (hide)

Owner ASAHI KASEI KABUSHIKI KAISHA

Inventors MATSUDA, Hideki

Pub. Number AU-A-2003213432

PCT Number PCT/JP03/02800

PCT Pub. Number WO2003/077035

Priority 2002/67116 12.03.02 JP

Filing date 10 March 2003

Wipo publication date 22 September 2003

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

H05K 003/18 Apparatus or processes for manufacturing printed circuits - using precipitation techniques to apply the conductive material

G03F 007/033 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

G03F 007/004 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Photosensitive materials

C08F 002/50 Processes

C08F 265/02 Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group

C08F 290/06 Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups

C08F 290/02 Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups

C08F 299/06 Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002/67116 12.03.02 JP

30 October 2003 Application Open to Public Inspection

  Published as AU-A-2003213432

2 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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