POLISHING EQUIPMENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE EQUIPMENT

Details for Australian Patent Application No. 2003213394 (hide)

Owner NIKON CORPORATION

Inventors HOSHINO, Susumu

Pub. Number AU-A-2003213394

PCT Number PCT/JP03/03150

PCT Pub. Number WO2003/078103

Priority 2002-077745 20.03.02 JP

Filing date 17 March 2003

Wipo publication date 29 September 2003

International Classifications

B24B 037/00 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped

B24B 057/02 Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002-077745 20.03.02 JP

6 November 2003 Application Open to Public Inspection

  Published as AU-A-2003213394

9 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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