TRANSFER PALETTE FOR FPC BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR CHIP ON FPC BOARD

Details for Australian Patent Application No. 2003213383 (hide)

Owner MITSUBISHI PLASTICS, INC.

Inventors IIDA, Hirofumi; TSUNEKAWA, Takeyuki

Pub. Number AU-A-2003213383

PCT Number PCT/JP03/03088

PCT Pub. Number WO2003/079744

Priority 2002-380156 27.12.02 JP; 2002-72756 15.03.02 JP; 2002-72757 15.03.02 JP

Filing date 14 March 2003

Wipo publication date 29 September 2003

International Classifications

H05K 013/02 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components - Feeding of components

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002-380156 27.12.02 JP; 2002-72756 15.03.02 JP; 2002-72757 15.03.02 JP

6 November 2003 Application Open to Public Inspection

  Published as AU-A-2003213383

2 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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