UNDERFILL ENCAPSULANT FOR WAFER PACKAGING AND METHOD FOR ITS APPLICATION

Details for Australian Patent Application No. 2003212987 (hide)

Owner NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION

Inventors TONG, Quinn, K.; XIAO, Yue; MA, Bodan; HONG, Sun, Hee

Pub. Number AU-A-2003212987

PCT Number PCT/US03/03927

PCT Pub. Number WO2003/075338

Priority 10/084,869 01.03.02 US

Filing date 10 February 2003

Wipo publication date 16 September 2003

International Classifications

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/29 Details of semiconductor or other solid state devices

C08G 059/50 Polycondensates containing more than one epoxy group per molecule

C08G 059/68 Polycondensates containing more than one epoxy group per molecule

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 10/084,869 01.03.02 US

23 October 2003 Application Open to Public Inspection

  Published as AU-A-2003212987

18 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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