PACKAGING MICROELECTROMECHANICAL STRUCTURES

Details for Australian Patent Application No. 2003212969 (hide)

Event Publications

24 July 2003 Complete Application Filed

Priority application(s): 10/106,728 26.03.02 US

20 November 2003 Application Open to Public Inspection

Published as AU-A-2003212969

16 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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