ELECTRONIC CIRCUIT DEVICE AND PORDUCTION METHOD THEREFOR

Details for Australian Patent Application No. 2003211879 (hide)

Owner TOYO KOHAN CO., LTD.

Inventors SAIJO, Kinji; YOSHIDA, Kazuo; OHSAWA, Shinji

Pub. Number AU-A-2003211879

PCT Number PCT/JP03/02784

PCT Pub. Number WO2003/077307

Priority 2002-64666 11.03.02 JP; 2002-64632 11.03.02 JP

Filing date 10 March 2003

Wipo publication date 22 September 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002-64666 11.03.02 JP; 2002-64632 11.03.02 JP

30 October 2003 Application Open to Public Inspection

  Published as AU-A-2003211879

25 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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