PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR FORMING PHOTOSENSITIVE ELEMENTS OR RESIST PATTERNS WITH THE SAME, AND PROCESS FOR PRODUCTION OF PRINTED WIRING BOARDS

Details for Australian Patent Application No. 2003211797 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors NATORI, Michiko; HIDAKA, Takahiro

Pub. Number AU-A-2003211797

PCT Number PCT/JP03/02255

PCT Pub. Number WO2003/073168

Priority 2002-054451 28.02.02 JP

Filing date 27 February 2003

Wipo publication date 9 September 2003

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

H05K 003/06 Apparatus or processes for manufacturing printed circuits - the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

H05K 003/18 Apparatus or processes for manufacturing printed circuits - using precipitation techniques to apply the conductive material

G03F 007/028 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - with photosensitivity-increasing substances, e.g. photoinitiators

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002-054451 28.02.02 JP

16 October 2003 Application Open to Public Inspection

  Published as AU-A-2003211797

18 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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